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tial bonding bar to the fixed earthing terminal and the connec-  LPZ 1) must be integrated in the equipotential bonding system.
          tion of pipes to the equipotential bonding system.  While the equipotential bonding for data lines is described in
          The integration of cable shields in the equipotential bonding   section 7.5.3, the equipotential bonding for electrical power
          system is described in chapter 7.3.          lines will be described in the this section. The boundaries for the
                                                       equipotential bonding system at the transition from LPZ 0 A  to
                                                       LPZ 1 are defined with the help of the specific design of the ob-
          7.5.2  Equipotential bonding for power supply   ject requiring protection. For installations supplied by low-volt-
               systems                                 age systems, the boundary LPZ 0 A  / LPZ 1 is mostly assumed to
                                                       be the boundary of the building (Figure 7.5.2.1).
          As  is  the  case  with  metal  installations,  all  electrical  power
          and data lines entering the building (transition from LPZ 0 A  to








                                        SPD                    SPD
                                        0/1                    0/1




          Figure 7.5.2.1  Transformer outside the structure  Figure 7.5.2.2  Transformer inside the structure (LPZ 0 integrated in
                                                                 LPZ 1)


                                                       Reinforcement of the outer walls and the foundation
                                                       Other earth electrodes, e.g. intermeshing to neighbouring buildings
                                                       Connection to the reinforcement
                                                       Internal (potential) ring conductor
                                                       Connection to external conductive parts, e.g. water pipe
                                                       Type B earth electrode, ring earth electrode
                                                       Surge protective device (SPD)
                                                       Equipotential bonding bar
                                                       Electrical power or information technology line
                                                       Connection to additional earth electrodes, type A earth electrodes


          Figure 7.5.2.3  Example of an equipotential bonding system in a structure with several entries for the external conductive parts and with an
                   inner ring conductor connecting the equipotential bonding bars

          Lightning protection level           Lightning impulse current carrying capability
           (previously: class of LPS)  In TN systems     In TN systems (L – N)  In TT systems (N – PE)
                     I                 ≥ 100 kA/m           ≥ 100 kA/m             ≥ 100 kA
                    II                 ≥ 75 kA/m             ≥ 75 kA/m              ≥ 75 kA
                   III / IV            ≥ 50 kA/m             ≥ 50 kA/m              ≥ 50 kA
          m: number of conductors, e.g. m = 5 in case of L1, L2, L3, N and PE
          Table 7.5.2.1   Required lightning impulse current carrying capability of type 1 surge protective devices depending on the lightning protection level and
                   the type of low-voltage consumer’s installation (see also German VDN guideline “Surge Protective Devices Type 1 – Guideline for the
                   use of surge protective devices (SPDs) Type 1 in main power supply systems” and IEC 60364-5-53 (HD 60364-5-534))



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